Lessengers to Present an Industry-First Immersion Cooling Demonstration at the SC25 Supercomputing Conference and Exhibition

- Liquid Immersion Cooling is Becoming a Preferred Method to Lower Heat and Reduce Energy Consumption in Data Centers

- Lessengers’ “Direct Optical Wiring” Process Helps Enable the “Optics for AI” Needed for Advanced Networking Connections and Lower Power Consumption

LESSENGERS Inc., a provider of innovative optical components based on its patented “direct optical wiring” (DOW) technology, will conduct an industry-first demonstration of an immersion-cooled detachable 800G NPO (near-packaged optics) module directly integrated with an AlphaCHIP1600-IO chiplet from Alphawave Semi at the SC25 event in booth 5308 at the America’s Center Convention Complex in St. Louis. Both the optics and chiplet are completely submerged in the cooling liquid.

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Immersion-cooled NPO/chiplet operating with 800G Ethernet switch

The demonstration, running November 18^th – 20^th, will also show interoperability with Lessengers’ 800G optics operating in a commercially-available 800G Ethernet switch.

DOW is polymer-based air-cladded waveguide technology that replaces the use of lens optics in transceivers. It is a direct coupling method that creates a hermetically sealed environment and, as a result, protects the optics from cooling fluids. Therefore, the Lessengers 800G NPO eliminates the costs associated with the additional sealing, packaging or assembly required to make similar products suitable for immersion cooling.

In addition, NPO designs offer serviceability and open ecosystem benefits that offer deployment and other “time-to-market” advantages.

Other DOW features contributing to the energy efficiency, bandwidth and performance attributes of NPO (and CPO – co-packaged optics) include:

• No multi-channel lens assemblies
• No active alignment
• Near-zero optical crosstalk

Lastly, the transition to 1.6T (Terabit) connectivity has begun and 3.2T optics are approaching commercial feasibility. Immersion cooling will be essential for these high-speed components, as their thermal capacity exceeds the limits of conventional air cooling, particularly in dense environments where a thermal crosstalk becomes a critical risk.

“The world’s most powerful supercomputers are liquid cooled and DOW is positioned to become a preferred option for AI/ML optical interconnects in sustainable data centers,” said Chongcook Kim, CEO of Lessengers. “The hyperscaler community is pivoting towards immersion cooling for next-generation generative and agentic AI/ML workloads, as it enables higher thermal efficiency, increased rack density and notable energy savings over air cooling.”

Sue Hung Fung, Principal Product Line Manager at Alphawave Semi, said, “Our partnership with Lessengers leverages their impressive DOW-based optical transceiver modules at the board interface and the direct integration of their NPO technology with our chiplet technology, enabling high-performance optical connectivity.”

In addition to the live demonstration of the immersion-cooled 800G NPO with chiplet, Lessengers will feature 1.6T/800G/400G optical transceiver and active optical cable products, future connectivity options with co-packaged and near-packaged optic assemblies and a demonstration of how DOW facilitates the benefits of immersion cooling in the data center.

About Lessengers

Lessengers is an innovative optical solution provider, powered by its patented DOW technology enabling cost effective direct optical coupling without lens optics. This provides the most suitable solution for data center applications including 800G/1.6T optical transceivers, active optical cables (AOCs), on-board, near packaged, or co-packaged optics.

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The world’s most powerful supercomputers are liquid cooled and DOW is positioned to become a preferred option for AI/ML optical interconnects in sustainable data centers.